• Curved silicon sensor module for particle detection experiments
  • Phonon dispersion of barocaloric adamantan
  • Molecular quantum device

Welcome to The Centre for Experimental and Applied Physics

Researchers at CEAP work on harnessing renewable energy sources, improving energy storage systems, and enhancing energy efficiency. From thermoelectric harvesting of waste heat to green refrigeration, we are contributing to the transition to a greener future.

Our quantum technologies research focusses on engineering quantum mechanical properties of molecules and low-dimensional materials to develop novel nano- and quantum-based sensors and devices, quantum computing for solving problems across disciplines, and emerging applications in healthcare.

The centre is exploring novel semiconductor materials, fabrication processes, and device designs. Our expertise covers a range of materials and applications, from flexible, low-cost organic semiconductors to space grade semiconductors, and from optoelectronics to particle detectors.

We are leveraging the power of artificial intelligence and data science to extract valuable insights from vast datasets, with applications covering materials science, drug discovery, particle physics, and space weather.



Recent Publications

  • Haddad L, Gianolio D, Dunstan DJ, Liu Y, Rankine C and Sapelkin A (2024). Quantifying Intuition: Bayesian Approach to Figures of Merit in EXAFS Analysis of Magic Size Clusters. Nanoscale 
  • Liu J, Du J, Wyatt PB, Keen DA, Phillips AE and Dove MT (2024). Orientational order/disorder and network flexibility in deuterated methylammonium lead iodide perovskite by neutron total scattering. Journal of Materials Chemistry A, Royal Society of Chemistry (RSC) vol. 12 (5), 2771-2785.  
  • Li L, Dove MT, Wei Z, Phillips AE and Keeble DS (2024). Electronic origin of negative thermal expansion in samarium hexaboride revealed by X-ray diffraction and total scattering. Physical Chemistry Chemical Physics, Royal Society of Chemistry (RSC) vol. 26 (9), 7664-7673.  

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