Events

Date: 2 October 2026   Time: 12:15 - 13:15     

Location: David Sizer LT + Online

Seminar Online Link

Synopsis

The relentless demand for multi-gigabit wireless communication and high-resolution sensing drives rapid innovation in D-band (110–170 GHz) systems. However, realizing efficient and scalable active phased arrays at these frequencies remains challenging due to high cost, interconnect losses, packaging parasitics, and heterogeneous integration constraints. This talk presents a holistic, system-level approach to low-loss D-band phased array integration that unifies circuit, antenna, and packaging co-design. Leveraging both silicon-based (CMOS, SiGe) and III–V integrated circuits, the approach emphasizes optimized beamformer and power amplifier architectures combined with low-cost 2D scalable, wide-angle scanning wideband antenna arrays implemented using low-cost PCB processes. Through electromagnetic co-optimization and advanced interconnect engineering, the framework achieves significant reduction in loss and improvement in overall system efficiency. Measured D-band results from prototype modules demonstrate wide-angle beam steering and data transmission rates up to 100 Gb/s. These results confirm the feasibility of steerable, high-capacity arrays suitable for both communication and sensing platforms.

Biography

Kamil Yavuz Kapusuz (Senior Member, IEEE) received the M.Sc. degree in Electrical Engineering from Atilim University, Ankara, Turkey, in 2013, and the Ph.D. degree in Electrical Engineering from the Electromagnetics Group, Department of Information Technology, Ghent University, Bel-gium.
From 2014 to 2016, he was a Senior Antenna Engineer at Remote Sensing Technologies, Turkey. From 2021 to 2022, he was a Visiting Scientist at CNRS, IETR Laboratory, France. Since 2022, he has been a Senior Researcher in Electromagnetics at IMEC and Ghent University. His research interests include the analysis and design of quasi-optical systems, leaky-wave antennas, near-field focusing techniques, in/on-body communication, millimeter-wave and sub-terahertz phased arrays, and EM modelling and optimization of 2.5D/3D RF packaging architectures.